Capabilities - PCB Design Rules : Flex & Rigid Flex
Our PCB capabilities have a fine blend of Flex PCB Manufacturer and high-tech machinery for Flex PCB Assembly. We derive proven PCB Design according to the predetermined standards as under:
Capabilities By Market: | |
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1. | High Reliability Boards |
-Up to 2000 Thermal cycles | |
-For Boards that must not fail | |
2. | Burn-in Boards |
-14 Layers - .062" thick | |
-.5 mm pitch | |
-Step-down connectors | |
-Special materials | |
-Large sizes up to 24" x 28" | |
-High Reliability | |
3. | High Technology Boards |
-Differential Impedance | |
-Up to 30 Layers | |
-Lead Free process | |
-Special materials | |
-Sequential lamination | |
-Blind and buried vias | |
-Laser Drill | |
-Filled vias | |
-Via in pads | |
-Milspec | |
-Metal core | |
-Carbon paste | |
-Plated edges | |
-Plated edge holes | |
-Milling | |
-Heavy Copper | |
-Selective Finishes | |
4. | Standard Technology Boards |
-1 to 10 Layers | |
-Trace/Space 5/5 | |
-Same day for 2 Layer PCBs | |
-24 hours to 10 Days for multilayer | |
-Lead Free process | |
-All standard materials |
Capabilities By Process: |
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Front-end CAM |
-Fully automated Tooling System |
Imaging-Laser Direct Imaging |
-Trace/Space 2/2 |
Multilayer Lamination |
-Up to 30 Layers |
-Sequential lamination |
-Automated registration |
Drilling |
-.006" Mechanical Drill |
-Laser Drill down to 2 mils (.002") |
Etching |
-Trace/Space 2/2 mils |
Plating |
-Aspect ratio 10+ |
Soldermask |
-LPI, Dry Film |
Silkscreen |
-Automated |
-5 mil lines |
Fabrication |
-Route and retain |
-Scoring |
Electrical Test |
-.5mm pitch, Flying probe and High Density grid |
Quality and Production Control Information System |
-Pro-CIM |
Materials |
-Lead Free FR-4 |
-Polyimides |
-Rogers 4003 & 4350 |
-Teflons |
-Ceramics |
-Most other materials |
PCB Capabilities
Press Release
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