Ball Grid Arrays
During PCB assembly and manufacturing, Ball Grid Arrays (BGAs) may need to be re-balled, from time to time. Sometimes a BGA may get damaged or a cold solder or bridge is created, which require depopulating the BGA for BGA Rework. The EMS provider should have certain capabilities and experience to deal with this issue. Those capabilities involve Printed Circuit Board materials, BGA placement systems, and specific BGA rework systems.
BGA Rework Services Offered
- BGA Remove and Placement
- Level Three Pad Repair
- Wire Add
- Trace Repair
- BGA Re-Balling
- BGA Inspection
Assembly House, Inc. Rework
- PBGA (Plastic Ball Grid Array)
- TBGA (Tape Ball Grid Array)
- uBGA (Micro BGA)
- CCGA (Ceramic Column Grid Array)
- CBGA (Ceramic Ball Grid Array)
- CPGA (Ceramic Pin Grid Array)
- Interposers
- Double stacked components
- Ball Grid Array Connectors
- Grounded QFP (Quad Flat Pack)
- Grounded SOIC (Small Outline Plastic Packages)
- Lead Free BGA (Ball Grid Array
PCB Assembly
Industries
SANTA ANA, CA - October 12, 2010: Assembly House, Inc. (AHI) made a significant capital investment by purchasing a new, state-of-the-art BGA Install and Rework (Reballing) machine and Scienscope 3D X-Ray Inspection System.
SANTA ANA, CA - August 27, 2010: Assembly House, Inc. (AHI) announced today that Ken Ghadia, Sr. Mfg. Engineer, obtained certification as a trainer for the latest revision of J-STD-001E.
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AHI - Assembly House, Inc. specialize in PCB Manufacturing, PCB Assembly and Printed Circuit Board Design located in Santa Ana, California
Opt for a world-class Printed Circuit Board Assembly at Assembly House, Inc.
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