Capabilities - PCB Design Rules : Flex & Rigid Flex
Our PCB capabilities have a fine blend of Flex PCB Manufacturer and high-tech machinery for Flex PCB Assembly. We derive proven PCB Design according to the predetermined standards as under:
| Capabilities By Market: | |
|---|---|
| 1. | High Reliability Boards |
| -Up to 2000 Thermal cycles | |
| -For Boards that must not fail | |
| 2. | Burn-in Boards |
| -14 Layers - .062" thick | |
| -.5 mm pitch | |
| -Step-down connectors | |
| -Special materials | |
| -Large sizes up to 24" x 28" | |
| -High Reliability | |
| 3. | High Technology Boards |
| -Differential Impedance | |
| -Up to 30 Layers | |
| -Lead Free process | |
| -Special materials | |
| -Sequential lamination | |
| -Blind and buried vias | |
| -Laser Drill | |
| -Filled vias | |
| -Via in pads | |
| -Milspec | |
| -Metal core | |
| -Carbon paste | |
| -Plated edges | |
| -Plated edge holes | |
| -Milling | |
| -Heavy Copper | |
| -Selective Finishes | |
| 4. | Standard Technology Boards |
| -1 to 10 Layers | |
| -Trace/Space 5/5 | |
| -Same day for 2 Layer PCBs | |
| -24 hours to 10 Days for multilayer | |
| -Lead Free process | |
| -All standard materials | |
| Capabilities By Process: |
|---|
| Front-end CAM |
| -Fully automated Tooling System |
| Imaging-Laser Direct Imaging |
| -Trace/Space 2/2 |
| Multilayer Lamination |
| -Up to 30 Layers |
| -Sequential lamination |
| -Automated registration |
| Drilling |
| -.006" Mechanical Drill |
| -Laser Drill down to 2 mils (.002") |
| Etching |
| -Trace/Space 2/2 mils |
| Plating |
| -Aspect ratio 10+ |
| Soldermask |
| -LPI, Dry Film |
| Silkscreen |
| -Automated |
| -5 mil lines |
| Fabrication |
| -Route and retain |
| -Scoring |
| Electrical Test |
| -.5mm pitch, Flying probe and High Density grid |
| Quality and Production Control Information System |
| -Pro-CIM |
| Materials |
| -Lead Free FR-4 |
| -Polyimides |
| -Rogers 4003 & 4350 |
| -Teflons |
| -Ceramics |
| -Most other materials |