PCB Fabrication Capabilities

PCB Fabrication Capabilities

Our core deliverables on PCB Manufacturing and PCB Assembly are outlined below:

Design and Test

  • 2 mil Trace Width
  • 3 mil Air Gap
  • IPC Class 2 / IPC Class 3
  • Flying Probe Net List Test
  • Differential Impedance
  • TDR Testing
  • Automatic Optical Inspection

Lamination

  • 1 to 30 Layers
  • Vacuum Lamination
  • Sequential Lamination

Drill and Rout

  • Counter Sinks / Counter Bores
  • Scoring / Rout & Retain
  • Laser Route
  • Blind Vias / Buried Vias
  • Stacked Vias

Plating

  • Conductive Via Fill
  • Non-Conductive Via Fill
  • Plated Edges
  • Plated Radii (Castellation)
  • Plated Milling Cutouts
  • Hard Gold Body
  • Soft Bondable Gold
  • Immersion Gold
  • Immersion Silver
  • HAL Standard
  • HAL Lead Free (ROHS)
  • Entek (OSP)

Materials

  • Flex and Rigid Flex
  • Kapton™ & Non Kapton™
  • RF and High Speed Materials
  • Mix Materials / FR-4-Teflon
  • Metal Back Boards (LED/Power Distribution)
  • Heavy Cu 6 oz Finish Rigid and Rigid / Flex