PCB Fabrication Capabilities
Our core deliverables on PCB Manufacturing and PCB Assembly are outlined below:
Design and Test
- 2 mil Trace Width
- 3 mil Air Gap
- IPC Class 2 / IPC Class 3
- Flying Probe Net List Test
- Differential Impedance
- TDR Testing
- Automatic Optical Inspection
Lamination
- 1 to 30 Layers
- Vacuum Lamination
- Sequential Lamination
Drill and Rout
- Counter Sinks / Counter Bores
- Scoring / Rout & Retain
- Laser Route
- Blind Vias / Buried Vias
- Stacked Vias
Plating
- Conductive Via Fill
- Non-Conductive Via Fill
- Plated Edges
- Plated Radii (Castellation)
- Plated Milling Cutouts
- Hard Gold Body
- Soft Bondable Gold
- Immersion Gold
- Immersion Silver
- HAL Standard
- HAL Lead Free (ROHS)
- Entek (OSP)
Materials
- Flex and Rigid Flex
- Kapton™ & Non Kapton™
- RF and High Speed Materials
- Mix Materials / FR-4-Teflon
- Metal Back Boards (LED/Power Distribution)
- Heavy Cu 6 oz Finish Rigid and Rigid / Flex
PCB Fabrication
Press Release
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