Printed Circuit Board Assembly

Ball Grid Arrays

Ball Grid Arrays

We have solutions for all your BGA rework and repair needs. We're equipped with 5 top-of-the line BGA rework systems and a staff of engineers and operators with in-depth knowledge and experience at the intricate process of BGA rework.

We offer a wide variety of services including BGA component removal, replacement and salvage; x-ray inspection; circuit pattern design changes at BGA sites; repair of lifted or missing BGA pads; and repair of solder mask at the BGA sites.

BGA Pad and Solder Mask Repair

Repair of damaged solder mask between BGA pads and connecting vias is a critical step to prevent solder from flowing down the vias during BGA replacement.

Damaged or missing BGA pads are replaced by following an IPC recommended procedure BGA Pad Repair Procedure. This procedure uses specially fabricated adhesive backed BGA pads that are thermally bonded to the board surface.

BGA Site Modification

When your design requires a change or modification at a BGA site, using a standard jumper wire is normally not an option. Jumper wires are simply to large to fit under a BGA component. This ingenious modification procedure uses flat copper ribbon thin enough to fit safely under the BGA component.

BGA Component Removal and Replacement

We have 5 top-line Air-Vac BGA rework systems and a fully trained staff of engineers and operators to support you. This combination provides you with a repeatable process with every project meeting the highest quality standards.

We're recognized as an industry leader in BGA services and have been qualified by companies around the world. Whether you have one board or one thousand boards for rework, we're the company to turn to for BGA rework services.

BGA rework is a challenge, but not for the experts at

X-ray Inspection

X-ray services for BGA component and site inspection is completed on every board we process to ensure the highest quality level. We use a Nicolet X-ray system to inspect every BGA reworked. This system will pin point defects including solder joint shorts, opens, and voids.